MicroLine 2000 Ci

MicroLine 2000 Ci

Versatile, affordable, inline laser depaneling

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The LPKF MicroLine 2000 Ci is ideal for anyone who needs a versatile, efficient depaneling method. Powered by UV lasers that make clean, burr-free cuts, MicroLine 2000 Ci systems eliminate mechanical stress and greatly limit thermal stress. This makes the MicroLine 2000 Ci perfect for depaneling any substrate - from FR4 to ceramics, polyesters, and more.

The MicroLine 2000 Ci can be customized to fit your applications. Its inline chassis and can be equipped with either a 10, 15 or 27 watt nanosecond UV or 36 Watt nanosecond green laser source. An exhaust unit removes all material evaporated by the laser energy, ensuring board surfaces are residue-free. The built-in SMEMA interface allows users to add external loaders and/or conveyors of their choice (handling equipment as shown above is not included).

Technical Specifications: MicroLine 2000 Ci

Laser Class 1
Max. Working Area (X.Y.Z) 300 mm x 250 mm x 11 mm (11.8" x 9.8" x 0.4")
Max. Recognition area (X.Y) 300 mm x 250 mm (11.8" x 9.8")
Max. Material Size 300 mm x 250 mm (11.8" x 9.8")
Data Input Formats Gerber, X-Gerber, DXF, HPGL, Sieb & Meier, Excellon, ODB++
Max. Structuring Speed Dependant on application
Positioning Accuracy +/- 25 µm (1 mil)
Diameter of Focused Beam 20 µm (0.8 mil)
Laser Wavelength 355 nm
System Dimensions (WxHxD) 875 mm x 1530 mm x 1300 mm (34.5" x 60.2" x 51.2")*
Weight 450 kg (990 lbs)
Operating Conditions  
Power Supply 85 V- 260 V AC, 50-60 Hz, 440 W
Cooling Air-cooled (internal water-air cooling)
Compressed Air 0.6 Mpa (87 psi)
Ambient Temperature 22 °C +/- 2 °C (72 °F +/- 4 °F)
Humidity <60% (non-condensing)
Required Accessories Exhaust unit, external conveyor, production fixture
*    Height incl. StatusLight = 2020 mm (79.6”)
Technical specifications subject to change.