LDS MID Design Guide

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Developing molded interconnect device components is a challenging procedure no matter which process or technology is used. This LDS MID Design Guide helps interdisciplinary developers produce MIDs based on the LPKF laser direct structuring process. 
Topics include:

  • Injection molding design rules
  • Tool design
  • Data prep for laser processing
  • Metallization process rules
  • Thermal conditioning

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