Smaller, more complex, more compact. Modern electronics present manufacturers with these challenges and laser direct structuring (LDS) components offer an effective way to overcome these challenges by turning simple plastic components into high-quality 3D Interconnect devices. The LPKF Fusion3D 1100 is a new entry-level system that provides cost-effective access to this technology, and is ideal for small batches or 3D prototyping. Due the importance of creating prototypes as close to series as possible, which is often a time-consuming and costly process, the Fusion 3D 1100 and associated prototyping methods allow functional prototypes to be built in one day, without taking up production systems.
In today’s electronic labs, an increasing number of functions must be accomplished in a constantly dwindling space and as a result, components like plastic clips, panels and housing parts, which previously served a purely mechanical purpose, are now taking on electronics functions. Injection moldings are the basis for these three dimensional interconnect devices, also know as molded interconnect devices (MIDs). The LPKF Fusion3D 1100 laser structurer lowers the price threshold for entering the 3D MID market and can be used for manufacturing small and medium volumes.