In laser technology, the shorter the pulse, the lower the heat input into the surrounding material. A picosecond laser breaks down an important barrier. It practically eliminates heat transfer; the targeted material evaporates immediately.
The new ProtoLaser R is packaged in the familiar thirdgeneration ProtoLaser system housing. It is structurally decoupled from the effects of the environment and can be rolled through any lab door.
Unlike pure cutting applications, micro material processing does not require high powers. Instead, stable laser parameters in the lower output range are crucial. The LPKF ProtoLaser R features a laser source with a laser power of up to 4 W. This allows even complex thin film systems, temperature-sensitive substrates, and OLED coatings on glass to be ablated or structured with a high degree of control. The laser system requires no masks or films to accomplish these tasks.
The LPKF ProtoLaser R comes with tried and true system software. Support of all common CAD formats is enabled through the combination of LPKF CircuitPro and LPKF CircuitMaster.
Technical Specifications: ProtoLaser R
|Max. material size and layout area
(X x Y x Z)
|229 x 305 x 10 mm
( 9” x 12 “ x 0.4” )
|Laser wavelength||1 030 nm|
|Laser pulse frequency||Max. 200 kHz|
|Laser pulse duration||1 ps|
|Laser power||Max. 3.73 W|
|Laser spot diameter in focus position||15 μm (0.6 mil)|
|Table move speed (X x Y x Z)||100 x 100 x 10 mm/s
(4”/s x 4”/s x 0.4”/s)
|Dimensions (W x H x D)||875 x 1 430 x 820 mm
(34.5” x 56.3” x 32.3”)
|Electrical consumption||110 V - 230 V; 1.4 kW|
|Required accessories||PC, Exhaust unit, compressor|