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 Materials
  

 

Copper Board Material


Copper cladded FR4 board material. Epoxy substrate with glass fiber enforcment. Compliant with electroplating.

Multi Layer Material


Multi-Layer material and accessories.

Prototype SMT Stencils


Polymide foil to be cut with ProtoMat plotter to create prototype SMT stencils. Compatible with ZelFlex stencil frame.

Solder Mask and Silk Screen




Solder Paste


Lead-Free Solder Paste

Underlay Material


Underlay material is used to protect the LPKF machine’s table top or vacuum table during the drilling and routing phases. The LPKF underlay material is very flat & has a smooth surface with a white, very thin, hard coating on both sides to meet the highest demands for drilling quality.