In laser technology, the shorter the pulse, the lower the heat input into the surrounding material. As a picosecond 515nm green laser, it practically eliminates heat transfer and the targeted material evaporates immediately.
The new ProtoLaser R4 is packaged in the familiar thirdgeneration ProtoLaser system housing. It is structurally decoupled from the effects of the environment and can be rolled through any lab door.
Unlike pure cutting applications, micro material processing does not require high powers. Instead, stable laser parameters in the lower output range are crucial. The LPKF ProtoLaser R4 features a laser source with a laser power of up to 8 W and utilizes the LPKF patented hatch & delamination method for processing copper/metal removal on FR4 and laminated RF/HF materials. This allows even complex thin film systems, temperature-sensitive substrates, and OLED coatings on glass to be ablated or structured with a high degree of control. The laser system requires no masks or films to accomplish these tasks.
The LPKF ProtoLaser R4 includes a PC with new LPKF CircuitPro PL software for design import and machine operations in one platform.
Technical Specifications: ProtoLaser R4
|Max material size
(X x Y x Z)
|229mm x 305mm x 7 mm
(9” x 12” x 0.275”)
|Laser Wavelength||515 nm|
|Laser pulse frequency||50 to 500 kHz|
|Laser pulse duration||1.5 ps|
|Laser power||Max 8W|
|Weight||390 kg (860 lbs)|
|Dimensions (W x H x D)||910mm x 1650mm x 795mm
(height with open hood = 1765mm
|Electrical consumption||110 V - 230 V; 1.4 kW|
|Required accessories||Extraction unit/vacuum; compressed air supply|