The LPKF ProtoFlow S4 is a benchtop Infrared oven with Forced Air Circulation for lead-free reflow soldering and even temperature distribution. It is a key component in rapid SMD prototyping and small batch production. Compact and versatile, the ProtoFlow S4 offers a large working and microprocessor-controlled temperature/time profiles. The LPKF ProtoFlow S4 is excellent for SMD Reflow soldering, adhesive hardening by precipitation, hardening by precipitation of conductive paste for plated-through holes, and other thermal procedures. Active cooling at the end of the soldering process with the chamber closed prevents uncontrolled temperature fluctuations in the material. Dual channel air circulation allows for a fast cool down process and an exhaust port automatically opens with a vent outlet..
Visually monitoring of the process is made possible by the large inspection window in the door. Integrated interior lighting reveals the status of the soldering process and allows for on-the-fly job modification where needed to optimize the reflow process.
Technical Specifications: ProtoFlow S4
|Max. PCB size||310mm x 310mm (12.2" x 12.2")|
|Maximum heating area||320mm x 220mm (12.59" x 8.66")|
|Max. reflow temperature||290 °C (554 °F)|
|Outlet tube for active cooling||Outlet tube for active cooling|
|Time for temperature stabilization||220 °C, 64 h|
|Temperature Stabilization time||<5 min|
|Ambient temperature||0 – 40 °C (32 – 104 °F)|
|Power Supply||230 V, 50/60 Hz, single-phase 3.5 kW|
|Dimensions (W x D x H)||555 mm x 480 mm x 300 mm (21.7” x 18.9” x 11.8”)|
|Weight||38 kg (83.8 lbs)|
|Required software||Windows 10|