The LPKF Laser-based PCB development systems allow for rapid metal removal on a wide range of laminated PCB substrates and enable traces at and even below 1 mil (25µm) on fired ceramics. Pristine edge quality allows the laser etched designs to match simulation software nearly perfectly and the fine pitch traces and spacing are ideal for HDI (High Density Interconnect) PCB design requirements. This technology provides advanced prototyping and true production on-demand solutions.
Rapid PCB Laser Etching with the 1064nm LPKF laser source and 25µm focused beam diameter. This lower price option is a perfect complement for labs already operating an LPKF ProtoMat PCB milling system for drilling and cutting of thicker materials
Ultra-fast PCB Laser Etching, cutting and drilling with the LPKF 532nm laser source and a 23µm focused beam diameter. Ideal for laminated substrates and alumina based ceramics allowing fine pitch PCB development.
Pristine PCB Laser Etching quality with the LPKF 355nm laser source and 20µm focused beam diameter enables the smallest traces and spacing laminated substrates and alumina based ceramics in addition to controlled laser drilling, cutting, skiving and depth engraving.
High precision Laser Etching and highly controlled material engraving with a picosecond pulse duration. Ideal for advanced research applications with extremely low heat affect allowing surface metal removal and drilling or engraving on glass and fired ceramics.
Laser activation for prototyping three dimensional circuits with Laser Direct Stucturing (LDS) grade plastics and ProtoPaint coated materials.