Case Studies
Laser Direct Structuring
Imagine being an electronics manufacturing service (EMS) with a regular New Product Introduction period of 3-4 days. Imagine next spending half of that time frame waiting to receive products you cant fulfill your obligations without. With limitation hindering production, it becomes clear more efficient operations are needed.
Imagine being an electronics manufacturing service (EMS) with a regular New Product Introduction period of 3-4 days. Imagine next spending half of that time frame waiting to receive products you cant fulfill your obligations without. With limitation hindering production, it becomes clear more efficient operations are needed.
Developing molded interconnect device components is a challenging procedure no matter which process or technology is used. This LDS MID Design Guide helps interdisciplinary developers produce MIDs based on the LPKF laser direct structuring process.
Topics include:
- Injection molding design rules
- Tool design
- Data prep for laser processing
- Metallization process rules
- Thermal conditioning
Complete the form to receive instant access to this powerful tool.
