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Epoxy Mold Compounds (EMC) for Semiconductors can do More for you
You can learn more about the advantages of 3D integrated circuits here:
Reduced package cost
Up to 30% cost reduction for Package-on-Package
compared to traditional sequential layer build up technology
Improved thermal management
Up to 10x higher heat dissipation of mold-embedded copper heat sink (≈ 400 W/mK) compared to thermally conductive Epoxy Mold Compounds (≈ 4 W/mK)
Reduced package footprint
Up to 50% reduced via-diameter, -space, -pad, -annular ring
compared to traditional TMV drilling and copper paste printing
Increased package lifetime
Up to 50% greater solder joint reliability
compared to shear load distribution of traditional wire bonding
Molding of Epoxy Mold Compounds
New class of Epoxy Mold Compounds, designed for the patented Laser Direct Structuring (LDS) Technology
EMC available in granular and tablet form from a variety of compound suppliers
For Leadframe and Substrate applications
Virtually all existing compounds can be adopted for the Laser Direct Structuring and plating process
Laser Direct Structuring with LPKF Laser Tools
- Line/ Space of 25 um each
- Aspect ratio of 1:10
- Area pattern and via drilling in one step
- Fully automed and autonomous production
Direct Copper plating
- Laser Direct Structuring Technology enables direct electro-less plating of copper
- Several tens of micron copper thickness by subsequent chemical copper plating
- Selection of surface finishes, e.g. electro-less Nickel, immersion gold ("ENIG") available
- High aspect ratio plating from 1:1 (for blind vias) up to 1:10 (for true through mold vias)
More solutions for the semiconductor industry
Glass for Heterogeneous Integration -- a team of dedicated engineers and researchers allows you to take advantage of the latest process technology for thin glass applications while focusing on added value for your application.
