Reflow Oven for Lead-Free Soldering

The compact LPKF Edition SMT ProtoFlow S4 hot air oven is the ideal device for lead-free RoHS-compliant reflow soldering. The large viewing window in the thermally decoupled door allows visual control of the process. Depending on the solder used, the optimum process parameters can be stored in the integrated software.

In addition to predefined process profiles, custom temperature profiles and process times can be freely set in the software. These can be saved as custom profiles. Active cooling at the end of the soldering process with the chamber closed prevents uncontrolled temperature fluctuations in the material. Process-related odors or gases can be safely discharged to an exhaust system via an outlet opening.

Four thermocouples monitor perfect heat distribution in the process chamber and separately control the infrared heating elements on the top and bottom of the chamber. With the aid of a freely positionable additional temperature sensor, critical areas can be monitored separately directly on the PCB. The low-vibration mounting of the PCB in the process chamber supports the processing of double-sided PCBs.