Topic overview:
    LPKF ProtoLaser R4

    Infinite Laser Processing on Innovative Materials

    • Precision picosecond lasers for innovative research
    • Nondamaging processing of heat-sensitive materials
    • Intuitive CAM software
    • Ready-to-use laser class 1 laboratory system
    LPKF ProtoLaser R4 prototyping laser system

    Short Laser Pulses – Nondamaging Material Processing

    An important parameter in the laser microprocessing of materials is the pulse width. The LPKF ProtoLaser R4 with picosecond-fast laser pulses allows for extremely precise structuring of delicate substrates and cutting of hardened or fired technical substrates.

    Short Laser Pulses – Nondamaging Material Processing

    Laser Ablation with Practically No Heat Input

    In laser technology, the shorter the laser pulse, the lower the heat input into the surrounding material. With a picosecond laser, an important hurdle is over-come: there is practically no heat transfer; the targeted material evaporates immediately.

    Specialist for Micromaterial Processing

    This thermal effect is important for both the cutting and the surface processing of temperature-sensitive materials. The laser offers a very high pulse energy for cutting, for example, ceramic materials such as Al2O3 or GaN without discoloring the materials in the machin-ing process. Thanks to the low heat input, no micro-cracks arise in the material.

    Perfect Surfaces

    Also for surface processing applications such as ablation of transparent thin films or detachment of metal layers on plastic foils, a very stable laser input at a low laser power is required. The LPKF ProtoLaser R4 can easily straddle these diverging requirements. Standard FR4 and laminated HF materials can be processed just as well with this machine.

    Easy to Operate

    The high-precision software and the integrated cam-era are supported by the user-friendly LPKF CircuitPro software. This enables the user to complete projects on challenging materials in the in-house lab in a very short time.

    Application Examples

     Downloads

    Brochure
    LPKF ProtoLaser R4 (pdf - 218 KB)
    Download
    Prototyping Catalog
    Rapid PCB Prototyping Product Catalog (pdf - 4 MB)
    Download
    Prototyping TechGuide
    LPKF TechGuide Rapid PCB Prototyping (pdf - 3 MB)
    Download

    LPKF systems for Laser Structuring

    LPKF ProtoLaser U4

    Thanks to the specific wavelength of the UV laser, the ProtoLaser U4 can structure, engrave and cut materials in a single operation. This laser system is stable in the lower power range so that even thin and organic layers can be processed with minimal heat transfer.

     
    [Translate to USA:] ProtoLaser R4 -- picosecond laser
    LPKF ProtoLaser R4

    Laser ablation with practically no heat transfer: The shorter the processing pulse, the less heat is transferred to the adjacent material. The picosecond laser of the ProtoLaser R4 clears - an important hurdle falls: There is no more heat transfer to speak of, with the material struck by the laser evaporating right away.

     
    LPKF ProtoLaser S4

    The compact laser system produces precise, fine structures for demanding PCBs in a very short time. Using a special process, the ProtoLaser S4 quickly removes large copper areas from laminated substrates such as FR4. The ProtoLaser S4 also delivers excellent results on special materials for RF applications.

     
    LPKF ProtoLaser H4

    The Tabletop system enables efficient prototyping of digital and analog circuits, RF and microwave PCBs -- even for multilayer PCBs. It achieves precise geometries on virtually any material with the laser tool. Precise drilling and milling even of thick substrates using mechanical drilling.

     

     Contact Us

    ✕
    Logo: LPKF Laser & Elektronics